Major Semiconductor wafer foundries: Pure-Play
TowerJazz Semiconductor
{silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies}
SMIC 'Semiconductor Manufacturing International Corporation'
{0.35um to 90nm IC manufacturing services}
Shanghai Hua Hong NEC Electronics Company, Ltd.
{0.35-0.18um memory, logic and mixed signal technologies}
Silterra Malaysia Sdn. Bhd.
{0.13um, 0.18um and 0.22um technology}
SSMC
{0.25-micron - 0.14-micron with derivatives and embedded flash CMOS manufacturing process}
TSMC 'Taiwan Semiconductor Manufacturing Company Limited'
{65 nm, 90 nm, 0.13um, 0.15 / 0.18 um, 0.22 / 0.25um, 0.30 / 0.35um, 0.5 um}
UMC 'United Microelectronic Corporation'
{System on Chip (SoC)}
X-FAB Semiconductor Foundries
{CMOS; 1.0 - 0.18 um modular mixed-signal CMOS technologies. BiCMOS; 0.6 um technology. SOI-CMOS; 0.6 um & 1.0 um CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP}
Major Semiconductor wafer foundries: Services
TriQuint Semiconductor, Inc.
{150-mm Production Processes: 0.6 micron enhancement/depletion mode MesFET process with an integrated power MesFET and three thick global metal interconnect layers, Depletion mode MesFET process featuring thick metals up to 6.3 microns thick, InGaP HBT, 0.5 micron optical gate enhancement and depletion pHEMT, 0.13 micron optical gate depletion pHEMT.
100-mm Production Processes; 0.25-um mmW pHEMT, 0.25-um Ku pHEMT, 0.5-um Heterostructure FET (HFET), Vertical P-I-N (VPIN) Diode process, 0.15-um power pHEMT, 0.15-um LN mHEMT, 0.25-um mmW pHEMT, 0.25-um XKu pHEMT, 0.35-um Power pHEMT}
A listing of IC foundry services. The processes used are listed under the company name, in alphabetic order.
