Major Semiconductor wafer foundries: Pure-Play
Chartered Semiconductor Manufacturing
{0.13-micron process}
Jazz Semiconductor
{silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies}
SMIC 'Semiconductor Manufacturing International Corporation'
{0.35 Ìm to 90nm IC manufacturing services}
Shanghai Hua Hong NEC Electronics Company, Ltd.
{0.35-0.18µm memory, logic and mixed signal technologies}
Silterra Malaysia Sdn. Bhd.
{0.13µm, 0.18µm and 0.22µm technology}
SSMC
{0.25-micron - 0.14-micron with derivatives and embedded flash CMOS manufacturing process}
TSMC 'Taiwan Semiconductor Manufacturing Company Limited'
{65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm}
UMC 'United Microelectronic Corporation'
{System on Chip (SoC)}
X-FAB Semiconductor Foundries
{CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP}
Key Words: IC foundry services, Pure Play wafer foundry, semiconductor foundries, Turnkey, Process
A listing of IC foundry services. The processes used are listed under the company name, in alphabetic order.
