Major Semiconductor wafer foundries: Services
TriQuint Semiconductor, Inc.
{150-mm Production Processes: 0.6 micron enhancement/depletion mode MesFET process with an integrated power MesFET and three thick global metal interconnect layers, Depletion mode MesFET process featuring thick metals up to 6.3 microns thick, InGaP HBT, 0.5 micron optical gate enhancement and depletion pHEMT, 0.13 micron optical gate depletion pHEMT.
100-mm Production Processes; 0.25-µm mmW pHEMT, 0.25-µm Ku pHEMT, 0.5-µm Heterostructure FET (HFET), Vertical P-I-N (VPIN) Diode process, 0.15-µm power pHEMT, 0.15-µm LN mHEMT, 0.25-µm mmW pHEMT, 0.25-µm XKu pHEMT, 0.35-µm Power pHEMT}
A listing of IC foundry services. The processes used are listed under the company name, in alphabetic order.
Key Words: ASIC, IC foundry services, Pure Play wafer foundry, semiconductor foundries, Turnkey, Process
Pure Play Foundries: Semiconductor wafer foundries
All other Semiconductor manufacturers in order by name.
