Transistor Packages Styles TO61 Case style, Bolt Mounting
TO-61 Package
The TO-61 package is a through-hole case mount device. 10-32 threads.
Case mount. Also called a Bolt-Mount package. A type of package which provides a method of readily attaching one surface of the
semiconductor device to a heat dissipater to achieve thermal management of the case temperature. The TO-61 Case is isolated from any of the terminal leads. Same style as TO-59 Transistor case.
Terminal Leads; Lead 1 Emitter, Lead 2 Base, Lead 3 Collector.
