Transistor Packages

Semiconductor Package TO-263 Surface Mount style, 7-Terminal

TO-263 Semiconductor 7-Terminal Package drawing
TO-263 7-Terminal Package Drawing

Tab mount. A type of package which provides a method of readily attaching one surface of the semiconductor device to a heat sink to achieve thermal management of the case temperature. Other factors that may effect the mounting include using thermal grease.
When attached to a PWB a copper pad should be located underneath the thermal tab of the TO-263 with a minimum size detailed in the data-sheet. Heat dissipation is conducted out by the metal tab.

TO-263 Package Dimensions
7-Lead TO-220 Transistor Package Dimensions

Case temperature. Case temperature is that temperature measured at a specified point on the case of a semiconductor device. The JEDEC specification will define the location of the thermocouple on the case.

Note the location of the Thermal Pad.
Bottom tab is electrically connected to Ground.

Related topics:
Transistor Derating Guidelines
Including Thermal definitions

Types of Transistor cases
Voltage Regulator Manufacturers
Thermal Compounds

D2PAC Package note;
2-lead TO-263 Package
3-lead TO-263 Package
5-lead TO-263 Package
7-lead D2PAK [this page].

Through-hole version of a 5-lead TO-263;
7-Lead TO-220 Package.
Or a TO-262 with bent leads.

PC motherboard

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Modified 6/13/15
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