Semiconductor Package TO-263 Surface Mount style, 7-Terminal
TO-263 7-Terminal Package Drawing
Tab mount. A type of package which provides a method of readily attaching one surface of the
semiconductor device to a heat sink to achieve thermal management of the case temperature. Other factors that may effect the mounting include using thermal grease.
When attached to a PWB a copper pad should be located underneath the thermal tab of the TO-263 with a minimum size detailed in the data-sheet. Heat dissipation is conducted out by the metal tab.
Case temperature. Case temperature is that temperature measured at a specified point on the case of a semiconductor device. The JEDEC specification will define the location of the thermocouple on the case.
