Semiconductor Package TO-263 Surface Mount style, 5-Terminal
D2DPAK
TO-263 5-Terminal Package Drawing
Tab mount. A type of package which provides a method of readily attaching one surface of the
semiconductor device to a heat sink to achieve thermal management of the case temperature. Other factors that may effect the mounting include using thermal grease.
When attached to a PWB a copper pad should be located underneath the thermal tab of the TO-263 with a minimum size detailed in the data-sheet. Heat dissipation is conducted out by the metal tab
Case dimensions are provided in the table above and relate to the package graphic by the symbols in the table. Keep in mind that case dimensions will change depending on the number of leads on the device. So check the related pages for different package dimensions.
Case temperature. Case temperature is that temperature measured at a specified point on the case of a semiconductor device. The JEDEC specification will define the location of the thermocouple on the case.
