Diode Package DO-8 Case style, Bolt-Mount
DO-8 Diode Package
The DO-8 package is a Through-Hole device, PWB or Panel mount component.
The DO-8 style package is similar to a DO-9 and DO-30 package.
Case Mount. A type of package which provides a method of readily attaching one surface of the
semiconductor device to a heat dissipater to achieve thermal management of the case temperature.
The heat dissipater could be a heat sink or the metal wall of a chassis or panel.
This package style or mounting type is also called a Screw Mount, Stud Mount, Bolt Mount, Chassis Mount or Panel Mount package.
