DO-13 Axial Lead Package
Diode Package DO-13 Case style, Through-Hole
DO-13 Diode, Axial Lead Component Package
The DO-13 package is a Axial Leaded Through-Hole device, with lead 1 electrically connected to the case. This particular example is of a 1N6036A, 1500 watt, bi-directional, silicon, transient voltage suppressor diode [TVS].
Standard Axial Lead mounting methods should be used; bend the leads near the component body and insure the body is raised up just above the surface of the PWB. The short leads between the DO-13 and the PWB insure good heat conduction into the board [Horizontal mounting]. Vertical mounting is also possible and results in more efficient heat conduction than horizontal mounting because of the single short lead.
There are a number of TVS diodes that use this type of package to include 1N6036A through 1N6072A [Derating Curve].
Heat sinks are available for axial leaded components, mounted horizontally to the board.
DO-13 Axial Lead Derating
DO-13 Diode Package Temperature-Power Derating Curve
DO-13 Diode Power Derating Curve
How to read the temperature curves; Interpreting Deraring Curves.
How to derate a Axial Lead Through-Hole DO-13 package with 3/8 inch leads based on operating temperature and max DC power dissipation. The graph shows two gray curves at which any DO-13 device should be operated at. The curve just above that is the curve that most electrical measurements. provided in data sheets, will be taken at. The final upper-most curve indicates the maximum junction temperature, above which damage to the semiconductor die occurs. Derate Temperature by Device; Diode Derating Curves.
The graph applies to still air, so supplying forced air to the system may allow the DO-13 to operate at a higher wattage then shown in the graph.
The leads of the DO-13 do help to conduct heat away from the body of the component. However the greatest amount of heat conduction occurs using the shortest lead length possible [conducting heat into the Printed Wiring Board]. Heat is also removed from the body of the DO-13 by convection and radiation.
Editor note; offhand I do not know what the small round ball is on one of there terminals. I don't ever recall coming across a part with something like that either. I assume the bump is used to identify one of the leads, but this particular device is symmetrical about the body of the device, so there's no need to highlight a terminal. I also don't know if the bump is part of the package definition.
