Previous page of Packaging Terms
Die: The semiconductor wafer cut into individual dies.
Die bonding: The attachment of an integrated circuit chip to a substrate or header.
Encapsulate: To seal or cover an element or circuit for mechanical and environmental protection.
ePTFE: Expanded PolyTetraFluoroEthylene.
Facedown bonding: A method of attaching a component or circuit chip to a substrate by inverting the chip and bonding chip contacts to the mirror-image contact points on the substrate.
Flatpack: An integrated circuit package whose leads extend from the sides and are parallel to the base.
Flip-chip: A chip that has bumped termination spaced on the face of the device and is designed for face-down mounting. Direct attachment of a bare die face down with the surface of the die being placed in direct contact with the substrate.
Footprint: The area occupied on the substrate by a component or element.
Laminate: A product made by bonding two or more layers together, usually of different materials, under heat and pressure to form a single structure.
Lead (Pb): A soft, heavy metal used in solder compositions and other alloys.
MCM: Multi Chip Modules. A hybrid microcircuit that contains two or more microcircuits, each having greater than 100,000 junctions. [Multi Chip Module Packaging]
Multilayer Molded package (MM): A PQFP with enhanced performance achieved by a pair of power and ground planes. These planes significantly reduce the power-ground capacitance, making the package ideal for high-speed device operation.
Pad: The metallized area on a substrate or on the face of an integrated circuit used for making electrical connections.
PCB: Printed Circuit Board.
PCTF: Plated Copper on Thick films.
Pitch: The nominal distance from center to center of adjacent conductors.
Plating: Metallic deposit on a surface, formed either chemically or electro-chemically.
RoHS The Restriction of Hazardous Substances standard limits the amount of certain elements used in the manufacture of electronic components. There are six chemicals that are controlled under the standard. Detailed RoHS Description
Vias: The through-holes in the PCB which connect one layer to another or which act as a thermal path from one layer to another.
