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[IC Converter/Adaptor Manufacturers] [IC Socket Manufacturer]
[Memory Socket Manufacturers]
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A listing of IC Converter and IC Socket Manufacturers,
Related sites, and Component links.
The products the companies produced are listed under the company name
which are indexed in alphabetic order.
Accutek Microcircuit Corporation {DIP Adaptors PLCC/SOIC/SOJ/TSOP/SOT/QSOP/MSOP to DIP modules, SOIC/SSOP/QSOP to Zip module - Drop in replacement for end-of-life DIP IC's}
Aries Electronics Inc. {ZIFF Socket - BGA Socket-DIP Socket-SIP Socket-Correct a chip-Display-2mm-Chip and wire}
Everett Charles Technologies 'ECT' {Scalable Test Sockets for Area-array Applications}
Emulation Technology Inc. {Field Configurable Adaptors Manufacturer}
Interconnect Systems Inc. {Adaptors/Converters QFP/BGA/SOIC/SOJ/SOP/TSOP to PGA/DIP-Obsolescence Solutions}
Ironwood Electronics {Prototyping/Device under Test Adaptors-Package/Device Converters - Extenders - Rotators... BGA, MLF, QFN Sockets & clips, PLCC, TSOP}
Meritec {SOP/SSOP/TSOP/PSOP Socket Converter Manufacturer}
The listing above of IC socket manufacturers is for correcting
design mistakes only. The list provides manufacturers of Chip-Changers,
Adapters, and Converters.
Check the IC Socket manufacturing listing {below} for all other types of
Sockets and Adaptors
{IC Socket Manufacturers Index}
Types of PC Processor Socket types, by Motherboard
3M {Test and Burn in-ZIPP-DIP-LCC-PQFP-CQFP IC Socket Manufacturer}
Advanced Interconnections Corp. {IC Sockets / Adapters for BGA, PGA, DIP, SIP and more-Peel-A-Way Removable Terminal Carriers}
Amp "Tyco" {DIMM Sockets, IC ZIF Socket Manufacturer}
Aries Electronics Inc. {ZIFF Sockets-BGA Sockets-DIP Sockets-SIP-Display-2mm-Chip and wire}
Azimuth Electronics {Test and Burn-in, Custom Prototype and Production, QFP, LCC, ZIF, Laser Diode}
CGN Technology Innovators {Wire Wrap Sockets for PLCC's/HC11}
Chupond America Inc. {DIP, PGA, PLCC, pin header, SIMM, zig-zag sockets}
Concord Electronics Corp. {Transistor Sockets}
ECE 'Excel Cell Electronic Co Ltd.' {DIP/PGA/ZIF Sockets, DIMM/DDR Socket Manufacturer}
Emulation Solutions {Adaptors-Emulator Tools-Programming/Logic Analyzer/Test/Prototyping Adaptors}
Emulation Technology Inc. {Adaptors-Emulator Tools-Programming/Logic Analyzer/Test/Prototyping Adaptors}
Enplas {Test and Burn in Socket Manufacturer, All Socket Types}
ept {Strips, PGA Sockets, SIMM Sockets, DIL Sockets}
E-tec {IC Sockets-Test and Burn in Sockets, All Socket Types}
FCI {LG-Array, SIP Sockets, PLCC Sockets, DIP Sockets, IPGA/PGA Screw Machine Sockets}
Harwin {IC Sockets, PLCC Socket manufacturer}
Kycon {SOJ/PLCC Sockets}
Loranger International Corp. {uBGA-BGA-LGA-ZIG/ZAG-SIP-SMD-SSMP-SOIC-LCC-PLCC-DIP-Flat Packs-Hybrids-SMD Sockets}
Meritec {DIMM Socket Manufacturer}
Mill-Max {DIP/SIP Sockets, Carriers-PLCC/PGA/BGA Sockets-Receptacles}
Molex {DIMM Sockets-SIMM Sockets-IC-PLCC Sockets-PGA Sockets-Card Edge}
Methode Electronics {BGA Socket - PLCC Socket Manufacturer}
Nepenthe Distribution Inc. {Test and Burn in Sockets- Provider of Interconnection, IC Package Substrate and Innovative and Advanced Handling Solutions}
Panasonic Electric Works {SOP/TSOP/QFP Socket Manufacturer}
Preci-Dip {DIL, SIL, PGA, BGA, PLCC sockets}
Robinson Nugent "3M" {DIMM-PLCC-SOJ-SOP-TSOP-PGA-SIP-DIP Sockets}
Wells-CTI {LGA/PGA/DIP/LCC/PLCC/TO Sockets-SMT BGA Test/Burn-In/Production IC Socket Manufacturer}
Yamaichi Electronics {High Density-DIP/SOP/ZIF Sockets, Test and Burn in Sockets}
Y-connect {DIP/PLCC SMT/Through Hole Socket Manufacturer}
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A list of Integrated Circuit Package Definitions which will spell out a
number of the IC socket acronyms used above is provided on the IC Package Type
Definitions page. The page provides both Surface Mount Devices and
Through Hole Device Package definitions, it also provides a few pictures
for some of the device types. The through hole devices listed above [DIP, or SIP] may come with pins that are; Solder Tail [Normal board solder], Press Fit Tail [Solderless mount into PCB], Extended [End and side stackable], Wire Wrap [Long pins for wire Wrap operation], or Display [Right angle]. The term ZIF means Zero-Insertion-Force, SMD means Surface-Mount-Device, SMT means Surface-Mount-Technology, DIL means Dual-In-Line, and SIL means Single-In-Line. Engineering Design Note: Sockets are used for debug, prototype or low volume production. How ever, there are many cases when the IC sockets need to be removed from the design and the chips need to be soldered to the PC board. The sockets add additional inductance [~ 5nH] to the IC pins and mutual capacitance between the pins. Some additional reasons to remove a socket include: Cost [from the addition of the socket], Vibration [ground or air systems], Extreme Temperature [expansion based on -40 to +70 Military Temperature ranges], Moisture issues [the PC needs a Conformal Coating], Logic issues [timing or inductance issues cause by the IC socket package], Requirements [some military specifications may not allow IC sockets], and documentation issues [caused by altering many parts rather then altering one board]. |
If any of these cases apply consider using JTAG to program the PROM or device.
{Back to IC Socket Manufacturers Index}
Listing of [Integrated Circuit] IC Socket manufacturers and vendors. The listing is subdivided into IC Socket Manufacturers, and IC Socket Converters/Adaptors manufacturers. The types of products or devices each manufacturer produces are listed under the company name, in alphabetic order. Additional component manufacturers may be found by selecting the Components icon below, or Electronic Equipment manufacturers may be found by selecting the OEM Equipment icon.
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