Zig Zag Package
Zig Zag Device, Through-hole
Zig Zag IC & Socket | Zig-Zag In-line Package Style |
A Zig Zag package is similar in style to a SIP package except that a Zig Zag package has two rows of leads which alternate. A SIP has a single row of pins aligned one after the other.
A Zig Zag package has terminals in two parallel rows oriented perpendicular to the seating plan arranged in a staggered configuration. No dimensions are provided because the package could take on any number physical size, the graphic is only mean to convey the basic outline of a component [the number of pins are a representative example].
Of course there's no real reason to use a ZIG-ZAG package, although there might still be a few legacy components [mature products] using them. Which should not be used in a design.
The standard advice given is to use a surface mount package for better performance and having a smaller package size, so a through-hole Zig-Zag package should be avoided.