LCC Package, Surface Mount Device [SMD]. Unformed leads
Unformed Leaded Chip Carrier IC
Unformed Leaded Chip Carrier [LCC], A surface mount device [SMD] that uses leads straight off the side of its body for board attachment as shown in the graphic above. However in this case the leads have not yet been formed or bent. Note the frame that hold the leads in place. The plastic frame is not part of the IC package.
A related component is a Leaded Chip Carrier, which is the same part with the leads moved to their correct position, or their final positions.
Of course the leads of this type of device takes up a great deal of space, but one reason to use this package would be because the design requires a MIL spec part.
Additional Surface Mount IC Packages, or different Through-hole IC Packages.
When possible always use a surface-mount part to reduce lead inductance.
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