Ceramic DIP IC Package Drawing

Ceramic DIP Integrated Circuit [CER-DIP]

Through Hole Dual In-line Package

A Ceramic DIP IC is a normal Dual In-line Package that uses Ceramic instead of Plastic for the IC body, at a higher cost.
Ceramic protects the IC from higher temperature and humidity conditions.
A Ceramic DIP is also called a CERDIP. Click the CERDIP for a larger view.
The graphic above shows a Through Hole Device in a Ceramic package.
The picture below shows different plastic dip sockets.

Different Types of DIP Sockets
DIP Sockets

DIP Sockets include; 6-pin, 8-pin, 14-pin and 22-pin sockets.
Note that the IC is a ceramic package in order to have better thermal characteristics, but the sockets are just molded plastic. The sockets don't have any electrical characteristics to change over temperature. Of course the sockets could be damaged by high heat, but the same amount of heat would also destroy the board the parts are mounted on. So the ceramic package is used to protect the junction temperature of the semiconductor which may be damaged by a much lower temperature than that which would damage the plastic housing of a DIP socket.

The most Commonly found [ceramic] DIP packages have an inter-lead spacing (or lead pitch) of 0.1 inch (2.54 mm). And having a Row spacing [associated with body width] varies depending on lead counts, with 0.3 in. (7.62 mm) or 0.6 inch (15.24 mm).

Both passive or active devices may be found using ceramic packages.

Another example of a ceramic dip is shown as a 8048 uP, with a UV window on the top of the package. Indicating that a semiconductor component made either of plastic or ceramic may have a window to erase a programmed part. Note that large DIP packages of that size made either of plastic or ceramic material are becoming less common, moving to PGA or BGA packages [for example].

Intel 8048 Ceramic DIP IC with UV window
A comparison between a Ceramic and Plastic DIP IC

Editor note; As an observation: usually ceramic packaged IC can be differentiated from plastic packages by sight. In general a plastic packaged IC is jet black, while a ceramic package is a dark gray. Also the entire body of a plastic package is the same [black] color [because it's a molded package]. While a ceramic package is dark gray but has a lite gray band running around the body at the height of the leads of the IC [which happens to be the glass sealant]. In addition [in general] the plastic body has a smother texture than a ceramic body, in that, visually the finish of a ceramic body appears to be more course. Note that the graphical drawing at the top of the page is depicted in reverse; the body is shown as white [clear] while the band is high-lighted with black shading. But the gray band is visible in each of the three photographs used as ceramic IC examples.

In general a ceramic part may be a military grade part, so will operate through the military temperature range. The normal commercial temperature range is defined between 0 and 32C, while the military range extends -55C to 125C. A military part could be defined by a number of different part numbers, but the TTL family would be a 54 part instead of a 74 part, as in 5400 or 7400 quad 2-input NAND gate. There are a few conventions used with the numbering sequence; IC Operating Temperatures. However the ceramic IC above shows a few part numbers, the 883 indicate that the part is qualified to MIL-STD-883 which is another indication its a DOD component.

CDIP package

Ceramic DIP IC
Ceramic DIP IC

Photo of a Ceramic AM27S45 IC and a Plastic PAL16R8 IC
8048 Ceramic DIP IC

Technical Tip;
Avoid DIP sockets when possible.
Use surface mount packages if possible.
Use the smallest DIP package available.
Always avoid using IC sockets.

Related topics;
Through Hole DIP Sockets
IC Package styles

IC sockets work for either
Plastic or Ceramic packages.

Ceramic DIP with two semiconductor cavities
Dual-cavity Ceramic DIP
PC motherboard

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