Ball Grid Array
 BGA Package Dimensions |
 BGA Package |
BGA [Ball Grid Array] is a surface mount package that uses solder balls to attach to the Printed Wiring Board [PWB].
BGA is a Surface Mount Package, and there are a number of styles;
CBGA: Ceramic Ball Grid Array
PBGA: Plastic Ball Grid Array
There are also a number of different ball patterns. Additional IC Package styles.
