Dictionary of Engineering Terms
"A"
"B"
"C",
"D",
"E",
"F",
"G",
"H",
"I",
"J",
"K",
"L",
"M",
"N",
"O",
"P",
"Q",
"R",
"S",
"T",
"U",
"V",
"W",
"X",
"Y",
"Z"
Tin Whisker Growth
Tin Whisker Tin whiskers are electrically conductive, crystalline structures of tin that sometimes grow from surfaces where tin (especially electro-plated tin) is used as a final finish."NASA".
Tin Whiskers growing on one pin of an IC can grow to a length that they could touch and short out the adjacent pin causing circuit failure.
Tin whisker growth: The use of alloys with tin content greater than 97 percent may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after, and can develop under typical operation conditions on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead have shown to inhibit the growth of tin whiskers.
Growth of Silver Sulfide Whiskers
Also refer to the dictionary of Printed Wiring Board Terms
