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Tin Whisker Growth
TIN WHISKER. Tin whiskers are electrically conductive, crystalline structures of tin that sometimes grow from surfaces where tin (especially electro-plated tin) is used as a final finish."NASA".
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Tin Whiskers growing on one pin of an IC can grow to a length that they could touch and short out the adjacent pin causing circuit failure.
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Tin whisker growth: The use of alloys with tin content greater than 97 percent may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after, and can develop under typical operation conditions on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead have shown to inhibit the growth of tin whiskers.
Growth of Silver Sulfide Whiskers
Also refer to the dictionary of Printed Wiring Board Terms
