"A"
"B",
"C",
"D",
"E",
"F",
"G",
"H",
"I",
"J",
"K",
"L",
"M",
"N",
"O",
"P",
"Q",
"R",
"S",
"T",
"U",
"V",
"W",
"X",
"Y",
"Z"
Unit Test Acronyms
| ALT | - | Accelerated Life Testing |
| AST | - | Accelerated Stress Testing |
| ATE | - | Automatic Test Equipment |
| BIST | - | Backward Instability Shock Test |
| CCA | - | Circuit Card Assembly |
| CFM | - | Cubic Feet per Minute |
| DPA | - | Destructive Physical Analysis |
| DUT | - | Device Under Test |
| ED | - | Electro-dynamic [ElectroDynamic] |
| ESD | - | ElectroStatic Discharge |
| ESDS | - | Electrostatic Discharge Sensitivity |
| ESS | - | Environmental Stress Screening [Burn-in] |
| FIST | - | Forward Instability Shock Test |
| FWHM | - | Full-Width Half-Max |
| HALT | - | Highly Accelerated Stress Test |
| HASS | - | Highly Accelerated Stress Screening |
| HTRB | - | High Temperature Reverse Bias |
| LINAC | - | Linear Accelerator |
| NIST | - | National Institute of Standards and Technology |
| PIND | - | Particle Impact Noise Detection |
| PoF | - | Physics of Failure, Point of Failure |
| RET | - | Reliability Enhanced Testing |
| RH | - | Relative Humidity |
| SIR | - | Surface Insulation Resistance |
| SOA | - | Safe Operating Area |
| SSOP | - | Steady-State Operating Power |
| STU | - | Sensitivity Test Unit |
| TLD | - | Thermoluminescence Dosimetry |
| TSP | - | Temperature Sensitive Parameter |
| TUT | - | Transistor Under Test |
| UUT | - | Unit Under Test |
------------------------------
Test Equipment Manufacturers, Thermal Chambers Manufacturers
Use Environment per MIL HDBK-217F Definitions
Mean Time Between Failures (MTBF) Definitions
DUT Transistor Circuit, Device Under Test
MIL-STD-2218 - Thermal Design, Analysis and Test Criteria for Airborne Electronic Equipment
MIL-HDBK-251 - Reliability / design Thermal Applications
MIL-STD-901D Shock Tests H.I {High Impact} Shipboard Machinery, Equipment, and System Requirements for
