Engineering Abbreviations
"A" "B", "C", "D", "E", "F", "G", "H", "I", "J", "K", "L", "M",
"N", "O", "P", "Q", "R", "S", "T", "U", "V", "W", "X", "Y", "Z"

Unit Test Acronyms

ALT - Accelerated Life Testing
AST - Accelerated Stress Testing
ATE - Automatic Test Equipment
AUT - Antenna Under Test
BIST - Backward Instability Shock Test
CCA - Circuit Card Assembly
CFM - Cubic Feet per Minute
DPA - Destructive Physical Analysis
DUT - Device Under Test [DUT Terms]
ED - Electro-dynamic [ElectroDynamic]
ESD - ElectroStatic Discharge [ESD Terms]
ESDS - Electrostatic Discharge Sensitivity
ESS - Environmental Stress Screening [Burn-in]
FIST - Forward Instability Shock Test
FWHM - Full-Width Half-Max
GUT - Gate Under Test
HALT - Highly Accelerated Stress Test
HASS - Highly Accelerated Stress Screening
HTRB - High Temperature Reverse Bias
LINAC - Linear Accelerator
NIST - National Institute of Standards and Technology
PIND - Particle Impact Noise Detection
PoF - Physics of Failure, Point of Failure
RET - Reliability Enhanced Testing
RH - Relative Humidity
SIR - Surface Insulation Resistance
SOA - Safe Operating Area [SOA Definition]
SSOP - Steady-State Operating Power
STU - Sensitivity Test Unit
TLD - Thermoluminescence Dosimetry
TSP - Temperature Sensitive Parameter
TUT - Transistor Under Test
UUT - Unit Under Test

DUT Transistor Circuit Schematic
DUT Transistor Circuit, Device Under Test

Test Equipment Manufacturers, Thermal Chambers Manufacturers

Use Environment per MIL HDBK-217F Definitions

Mean Time Between Failures (MTBF) Definitions

MIL-STD-2218 - Thermal Design, Analysis and Test Criteria for Airborne Electronic Equipment

MIL-HDBK-251 - Reliability / design Thermal Applications

MIL-STD-901D Shock Tests H.I {High Impact} Shipboard Machinery, Equipment, and System Requirements for

PC motherboard

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