"A" "B", "C", "D", "E", "F", "G", "H", "I", "J", "K", "L", "M",
"N", "O", "P", "Q", "R", "S", "T", "U", "V", "W", "X", "Y", "Z"

Unit Test Acronyms

ALT - Accelerated Life Testing
AST - Accelerated Stress Testing
ATE - Automatic Test Equipment
BIST - Backward Instability Shock Test
CCA - Circuit Card Assembly
CFM - Cubic Feet per Minute
DPA - Destructive Physical Analysis
DUT - Device Under Test
ED - Electro-dynamic [ElectroDynamic]
ESD - ElectroStatic Discharge
ESDS - Electrostatic Discharge Sensitivity
ESS - Environmental Stress Screening [Burn-in]
FIST - Forward Instability Shock Test
FWHM - Full-Width Half-Max
HALT - Highly Accelerated Stress Test
HASS - Highly Accelerated Stress Screening
HTRB - High Temperature Reverse Bias
LINAC - Linear Accelerator
NIST - National Institute of Standards and Technology
PIND - Particle Impact Noise Detection
PoF - Physics of Failure, Point of Failure
RET - Reliability Enhanced Testing
RH - Relative Humidity
SIR - Surface Insulation Resistance
SOA - Safe Operating Area
SSOP - Steady-State Operating Power
STU - Sensitivity Test Unit
TLD - Thermoluminescence Dosimetry
TSP - Temperature Sensitive Parameter
TUT - Transistor Under Test
UUT - Unit Under Test

------------------------------

Test Equipment Manufacturers, Thermal Chambers Manufacturers

Use Environment per MIL HDBK-217F Definitions

Mean Time Between Failures (MTBF) Definitions

DUT Transistor Circuit Schematic
DUT Transistor Circuit, Device Under Test


MIL-STD-2218 - Thermal Design, Analysis and Test Criteria for Airborne Electronic Equipment

MIL-HDBK-251 - Reliability / design Thermal Applications

MIL-STD-901D Shock Tests H.I {High Impact} Shipboard Machinery, Equipment, and System Requirements for

 
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