Specifications related to Printed Wiring Board [PWB] production:
MIL-P-55110: Military Specification, General Specification For Printed-Wiring Boards
MIL-PRF-31032: Military Specification, General Specification For Printed Circuit Board/Printed Wiring Board
ANSI/J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies
IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
MIL-I-46058:Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275: Printed Wiring For Electronic Equipment

PWB Production Vendors
Integrated Circuit Packaging {MCM, MCP, COB, Hybrid Manufacturers}
.... Chip On Board [COB Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}
.... Low Temperature Co-fired Ceramic [LTCC Packaging]
.... Multi Chip Module [MCM Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}
.... Plated Copper on Thick films [PCTF Packaging]
.... Hybrid Packaging
Semiconductor wafer foundries

Adhesives Manufacturers {Thermal, UV Cure, Conductive, Non-Conductive, Electrical Conductive, Elastimere}
.... Elastomer Adhesive Manufacturers {elastic adhesive; featuring a rubber-like elasticity and adhesiveness over some temperature range}
.... Electrically Conductive Adhesive Manufacturers {Electrically connects and mechanically bonds circuits to a variety of substrates}
.... Thermal Adhesive Manufacturers {Normally designed to conduct heat and not electricity. Including PSA types}
.... UV Cure Adhesive Manufacturers {UltraViolet light accelerate curing, used in equipment production}

Conformal Coating {FAQ, Manufacturers, Types of Conformal Coating}
Printed Circuit Board Dictionary
Packaging Glossary
{Terms and definitions}

Columns, Articles, and Papers {Douglas Brooks}
IPC Institute for Interconnecting and Packaging {IPC}
IPC Institute for Interconnecting and Packaging {Lead Free Page}
RoHS - restriction of the use of certain hazardous substances in electrical and electronic equipment, and WEEE information.
Restriction of Hazardous Substances, RoHS definition

MIL-PRF-38535E - Integrated Circuits (Micro-circuits) Manufacturing
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-55110F - Printed Wiring Board, Rigid, General Specification for
MIL-C-46058C - Insulating Compound, Electrical (For Coating Printed Circuit Assemblies)
MIL-C-47175A(MI) - Compound, Polyurethane, for Conformal Coating of Electronic Circuitry
MIL-C-14550B - Copper Plating, (Electro-Deposited)
MIL-STD-275E - Printed Wiring for Electronic Equipment
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design Requirements for
MIL-T-10727C - Tin Plating: Electro-Deposited or Hot-Dipped, for Ferrous and Non-ferrous metals

Chart of PWB External Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Chart of PWB Internal Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Graphic of Minimum Annular Ring, What is a Minimum Annular Ring.
Graph of PWB Ground Potential, moving away from a single point ground connection [example].
.... Description of Ground Loops

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