Modules containing a substrate with a number of semiconductor chips.

Multi-Chip Module Vendors
C-MAC MicroTechnology {MCM}

International Sensor Systems, Inc. {MCM}

IC Package Type Definitions {Surface Mount/Through Hole Device Package Types, Specifications}

The other packaging options are listed below;

Chip On Board [COB Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Low Temperature Co-fired Ceramic [LTCC Packaging]

Hybrid Packaging

Multi Chip Module [MCM Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Packaging Acronyms:
COB: Chip on Board
ePTFE: Expanded PolyTetraFluoroEthylene
HTCC: High-Temperature Co-fired Ceramic
LTCC: Low-Temperature Co-fired Ceramic
MCM: Multi Chip Modules. Smallest size and weight of the technologies
PCTF: Plated Copper on Thick films

MCM Hybrid Microcircuit

PWB Vendor Services

Surface Mount Technology Association, www.smta.org
.... Types of Conformal Coatings
........Acrylic Resin, Epoxy Resion, Silicon Resin, Polyurethane Resin, Paraxylylene.
IPC; Institute for Interconnecting and Packaging, www.ipc.org

Specifications related to Printed Wiring Board [PWB] production:
MIL-PRF-38534 - Hybrid Microcircuits, General Specification
MIL-PRF-38535E - Integrated Circuits (Micro-circuits) Manufacturing
MIL-M-55565C - Microcircuits, Packaging of
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-55110F - Printed Wiring Board, Rigid, General Specification for
MIL-C-46058C - Insulating Compound, Electrical (For Coating Printed Circuit Assemblies)
MIL-C-47175A - Compound, Polyurethane, for Conformal Coating of Electronic Circuitry
MIL-C-14550B - Copper Plating, (Electro-Deposited)
MIL-I-46058C - Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275E - Printed Wiring for Electronic Equipment
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design Requirements for
MIL-T-10727C - Tin Plating: Electro-Deposited or Hot-Dipped, for Ferrous and Non-ferrous metals
RoHS - Restriction of Hazardous Substances [RoHS definition]

Chart of PWB External Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Chart of PWB Internal Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Graphic of Minimum Annular Ring, What is the Minimum Annular Ring.
Graphic of Printed Wiring Board Ground Potential, moving away from a single-point ground connection

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