MEMS; MicroElectro-Mechanical Systems, or MicroElectroMechanical Systems is the technology related to very small machines or mechanical elements residing on a silicon substrate.

C-MAC MicroTechnology

Ecliptek Corporation {MEMS oscillators}

STMicroelectronics {Motion sensors based on MEMS (micro electro-mechanical systems)}

Packaging Acronyms:
COB: Chip on Board
ePTFE: Expanded PolyTetraFluoroEthylene
HTCC: High-Temperature Co-fired Ceramic
LTCC: Low-Temperature Co-fired Ceramic
MCM: Multi Chip Modules. Smallest size and weight of the technologies
PCTF: Plated Copper on Thick films

Specifications related to Printed Wiring Board [PWB] production:
MIL-P-55110: Military Specification, General Specification For Printed-Wiring Boards
MIL-PRF-31032: Military Specification, General Specification For Printed Circuit Board/Printed Wiring Board
ANSI/J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies
IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
MIL-I-46058:Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275: Printed Wiring For Electronic Equipment

PWB Vendor Services

Integrated Circuit Packaging

MIL-PRF-38535E - Integrated Circuits (Micro-circuits) Manufacturing
MIL-M-55565C - Microcircuits, Packaging of
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-55110F - Printed Wiring Board, Rigid, General Specification for
MIL-C-46058C - Insulating Compound, Electrical (For Coating Printed Circuit Assemblies)
MIL-C-47175A(MI) - Compound, Polyurethane, for Conformal Coating of Electronic Circuitry
MIL-C-14550B - Copper Plating, (Electro-Deposited)
MIL-I-46058C - Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275E - Printed Wiring for Electronic Equipment
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design Requirements for
MIL-T-10727C - Tin Plating: Electro-Deposited or Hot-Dipped, for Ferrous and Non-ferrous Metals
RoHS - Restriction of Hazardous Substances [RoHS definition]

Graph of PWB External Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise [degrees C] and current [amps].
Graph of PWB Internal Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Graphic of Printed Wiring Board Ground Potential, moving away from a single-point ground connection vs. change in voltage potential.

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