Integrated Circuit Packaging

Low Temperature Co-Fired Ceramic

Suppliers of Low Temperature Co-Fired Ceramic

C-MAC MicroTechnology {LTCC}

Remtec {Ceramic Packaging; metallized Ceramic Substrate}

Tektronix Component Solutions {Low-Temperature Co-fired Ceramic [LTCC]}

IC Package Type Definitions {Surface Mount/Through Hole Device Package Types, Specifications}

Additional options for IC / board packaging;

Chip On Board [COB Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Hybrid Packaging [using more than one technique]

Multi Chip Module [MCM Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Plated Copper on Thick films [PCTF Packaging]

Packaging Acronyms:
HTCC: High-Temperature Co-fired Ceramic
LTCC: Low-Temperature Co-fired Ceramic
LTCC is a multi-layer, glass ceramic substrate which embeds passive components within the substrate.
This is basically a board fabrication technique that embeds resistor and capacitors in the substrate to save board space.
So any vendors listed offer the capability to manufacture boards to this format.

Specifications related to Printed Wiring Board [PWB] production:
MIL-P-55110: Military Specification, General Specification For Printed-Wiring Boards
MIL-PRF-31032: Military Specification, General Specification For Printed Circuit Board/Printed Wiring Board
ANSI/J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies
IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
MIL-I-46058:Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275: Printed Wiring For Electronic Equipment

Topic Navigation: Engineering Home > Application Notes > Application notes on PWBs > IC Packaging Techniques > LTCC Packaging.

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Modified 7/17/2015
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