C-MAC MicroTechnology {LTCC}
Maxtek {Low-Temperature Co-fired Ceramic [LTCC]}
Remtec {Ceramic Packaging; Metallized Ceramic Substrate}
IC Package Type Definitions {Surface Mount/Through Hole Device Package Types, Specifications}
Additional options for IC / board packaging;
Chip On Board [COB Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}
Low Temperature Co-fired Ceramic [LTCC Packaging]
Multi Chip Module [MCM Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}
Plated Copper on Thick films [PCTF Packaging]
Packaging Acronyms:
COB: Chip on Board
ePTFE: Expanded PolyTetraFluoroEthylene
HTCC: High-Temperature Co-fired Ceramic
LTCC: Low-Temperature Co-fired Ceramic
MCM: Multi Chip Modules
PCTF: Plated Copper on Thick films
Specifications related to Printed Wiring Board [PWB]
production:
MIL-P-55110: Military Specification, General Specification For
Printed-Wiring Boards
MIL-PRF-31032: Military Specification, General Specification For
Printed Circuit Board/Printed Wiring Board
ANSI/J-STD-001: Requirements for Soldered Electrical and
Electronic Assemblies
IPC-6012: Qualification and Performance Specification for Rigid
Printed Boards
MIL-I-46058:Insulating Compound, Electrical (for Coating Printed
Circuit Assemblies)
MIL-STD-275: Printed Wiring For Electronic Equipment
Surface Mount Technology Association
{SMTA.org}
.... Types of Conformal Coatings
........Acrylic Resin, Epoxy Resion, Silicon Resin, Polyurethane Resin,
Paraxylylene.
IPC Institute for Interconnecting and
Packaging {IPC}
MIL-PRF-38535E - Integrated Circuits (Micro-circuits)
Manufacturing
MIL-M-55565C - Microcircuits, Packaging of
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board,
General Specification for
MIL-PRF-55110F - Printed Wiring Board, Rigid, General
Specification for
MIL-C-46058C - Insulating Compound, Electrical (For Coating
Printed Circuit Assemblies)
MIL-C-47175A(MI) - Compound, Polyurethane, for Conformal Coating
of Electronic Circuitry
MIL-C-14550B - Copper Plating, (Electro-Deposited)
MIL-I-46058C - Insulating Compound, Electrical (for Coating
Printed Circuit Assemblies)
MIL-STD-275E - Printed Wiring for Electronic Equipment
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for
Electronic Equipment Design Requirements for
MIL-T-10727C - Tin Plating: Electro-Deposited or Hot-Dipped, for
Ferrous and Non-ferrous Metals
RoHS - Restriction of Hazardous Substances
| Voltage Between Conductors |
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Surface Layers | Internal Layers |
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0.005" | 0.004" |
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0.015" | 0.008" |
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0.030" | 0.010" |
Chart of PWB
External Etched Copper Current Capacity: current rating based on
trace cross section in square mils, temperature rise and current in
amperes.
Chart of PWB
Internal Etched Copper Current Capacity: current rating based on
trace cross section in square mils, temperature rise and current in
amperes.
Graphic of Minimum
Annular Ring, What is the Minimum Annular Ring.
Graphic of Printed
Wiring Board Ground Potential, moving away from a single-point ground
connection
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