The four main IC packaging options are listed below.
The page links will provide manufacturing sources using each of the different packaging solutions.

Chip On Board [COB Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Low Temperature Co-fired Ceramic [LTCC Packaging]

Micro-Electro-Mechanical Systems [MEMS Packaging]

Multi Chip Module [MCM Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Plated Copper on Thick films [PCTF Packaging]

Packaging Glossary {Terms and Definitions for IC Packaging}

IC Package Type Definitions {Surface Mount/Through Hole Device Package Types, Specifications}

Packaging Acronyms:
COB: Chip on Board
ePTFE: Expanded PolyTetraFluoroEthylene
HTCC: High-Temperature Co-fired Ceramic
LTCC: Low-Temperature Co-fired Ceramic
MCM: Multi Chip Modules
PCTF: Plated Copper on Thick films

Specifications related to Printed Wiring Board [PWB] production:
MIL-P-55110: Military Specification, General Specification For Printed-Wiring Boards
MIL-PRF-31032: Military Specification, General Specification For Printed Circuit Board/Printed Wiring Board
ANSI/J-STD-001: Requirements for Soldered Electrical and Electronic Assemblies
IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
MIL-I-46058:Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275: Printed Wiring For Electronic Equipment

PWB Vendor Services
Semiconductor wafer foundries

Surface Mount Technology Association [www.smta.org]
.... Types of Conformal Coatings
........Acrylic Resin, Epoxy Resion, Silicon Resin, Polyurethane Resin, Paraxylylene.
IPC Institute for Interconnecting and Packaging [www.ipc.org]

MIL-PRF-38535 - Integrated Circuits (Micro-circuits) Manufacturing
MIL-M-55565 - Microcircuits, Packaging of
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-55110 - Printed Wiring Board, Rigid, General Specification for
MIL-C-46058 - Insulating Compound, Electrical (For Coating Printed Circuit Assemblies)
MIL-C-47175 - Compound, Polyurethane, for Conformal Coating of Electronic Circuitry
MIL-C-14550 - Copper Plating, (Electro-Deposited)
MIL-I-46058 - Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275 - Printed Wiring for Electronic Equipment [version E released in 1984]
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design Requirements for
MIL-T-10727 - Tin Plating: Electro-Deposited or Hot-Dipped, for Ferrous and Non-ferrous metals
RoHS - Restriction of Hazardous Substances definition

Chart of PWB External Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Chart of PWB Internal Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Graphic of Minimum Annular Ring, What is the Minimum Annular Ring.
Graphic of Printed Wiring Board Ground Potential, moving away from a single-point ground connection

Editor note; the military standards listed may not be available for down-load, and maybe withdrawn with out replacement.
For example MIL-STD-275E [revision 'E'] was released in 1984 but was cancelled in 1999.
The specification numbers used above also do not show the revision letter, because the revision may be changed.

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