All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
Annular ring: The portion of a conductive material that completely surrounds a hole.
Aperture: An opening, as a hole, gap, or slit.
BLT: Bondline Thickness-the thickness of adhesive between two adherands.
Bonding: The joining of two materials. The attachment of wires to an integrated circuit or the mounting of an integrated circuit to a substrate.
Bonding pads: Areas of metallization on the integrated circuit die that permit connection of fine wires or circuit elements to the die.
Bump: A means of providing a connection to the terminal area of a device. A small mound is formed on the device or substrate pads and is used as a contact for face-down bonding.
Bumped wafer: A semiconductor wafer which has undergone wafer bumping, an electro-plating process, to form gold bumps over the bond pad metallization. These pumps are welded to the gold-plated copper leads of the TAB tape during inner-lead bond to form the interconnections to the chip.
Buried via: A via hole not extending to the surface.
Burn-in: The process of screening out marginal component parts by exposing them to elevated temperatures and voltage stress.
COB: Chip on Board. An MCM integrated bare die mounted directly on to the interconnect substrate. [COB Packaging]
Conformal Coating: An insulative coating that conforms to the configuration of the object being coated.
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