Integrated Circuit Packaging

Chip On Board

COB: Chip-On-Board is the direct attachment of bare die to laminate printed circuit boards

C-MAC MicroTechnology
{Chip-on-Board; COB}

International Sensor Systems, Inc.
{Discrete Components down to 0402, Quad Flat Pack (QFP), Thin, Small Outline Package (TSOP), Small Outline Integrated Circuit (SOIC), Plastic Leaded Chip Carrier (PLCC)}

{Packages/Chip Carrier}

IC Package Type Definitions {Surface Mount/Through Hole Device Package Types, Specifications}

Other IC packaging options

Low Temperature Co-Fired Ceramic [LTCC Packaging]

Multi Chip Module [MCM Packaging] {MCM integrated bare die mounted directly on to the interconnect substrate.}

Hybrid Packaging; could use any size including 0402, QFP, TSOP, SOIC and so on.

Hybrid microcircuit. A microcircuit that contains two or more of a single type, or a combination of the following types of elements with at least one of the elements being active. a. Film microcircuit, b. Monolithic microcircuit, c. Semiconductor element, d. Passive chip or printed or deposited substrate elements

Packaging Acronyms:
COB: Chip on Board. bare die laminated to PWB
ePTFE: Expanded PolyTetraFluoroEthylene
HTCC: High-Temperature Co-fired Ceramic
LTCC: Low-Temperature Co-fired Ceramic
MCM: Multi Chip Modules
PCTF: Plated Copper on Thick films

PWB Vendor Services

Surface Mount Technology Association,
.... Types of Conformal Coatings
........Acrylic Resin, Epoxy Resion, Silicon Resin, Polyurethane Resin, Paraxylylene.
IPC Institute for Interconnecting and Packaging {IPC}

Military Specifications

MIL-PRF-38535E - Integrated Circuits (Micro-circuits) Manufacturing
MIL-M-55565C - Microcircuits, Packaging of
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-55110F - Printed Wiring Board, Rigid, General Specification for
MIL-C-46058C - Insulating Compound, Electrical (For Coating Printed Circuit Assemblies)
MIL-C-47175A(MI) - Compound, Polyurethane, for Conformal Coating of Electronic Circuitry
MIL-C-14550B - Copper Plating, (Electro-Deposited)
MIL-I-46058C - Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275E - Printed Wiring for Electronic Equipment
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design Requirements for
MIL-T-10727C - Tin Plating: Electro-Deposited or Hot-Dipped, for Ferrous and Non-ferrous metals
RoHS - Restriction of Hazardous Substances [RoHS definition]

Conductor Spacing per MIL-STD-275
Voltage Between Conductors Minimum Trace Spacing
DC or AC peak volts Surface Layers Internal Layers
0 - 100v 0.005" 0.004"
101 - 300v 0.015" 0.008"
301 - 500v 0.030" 0.010"

Related board data;

Chart of PWB External Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Chart of PWB Internal Etched Copper Current Capacity: current rating based on trace cross section in square mils, temperature rise and current in amperes.
Graphic of Minimum Annular Ring, What is the Minimum Annular Ring.
Graphic of Printed Wiring Board Ground Potential, moving away from a single-point ground connection

PC motherboard

Distributor rolodex Electronic Components Electronic Equipment EDA CDROM Software Engineering Standards, BOB card Cabled Computer Bus Electronic Engineering Design Table Conversion DB9-to-DB25.
DistributorsComponents Equipment Software Standards Buses Design Reference

Modified 1/9/12
Copyright © 1998 - 2016 All rights reserved Larry Davis