Printed Wiring Board Information

Internal Trace Current Capacity





Current handling capacity of internal copper etched traces.

maximum amount of current in an Internal Trace
PWB Etched Internal Copper Current Capacity




The graph above shows the amount of current an Internal trace on a printed wiring board can handle.
The picture provides the current rating based on trace cross section in square mils, temperature rise and current in amperes.
For example; if the trace width is 100 square mils, that trace can accept between 1.5A and 4 amps depending on the acceptable temperature rise.

External Trace Capacity
Dictionary of PCB Terms
PWB Production Vendors

Key Phrase:
How much current will a buried trace handle
What is the current rating of a Internal trace
What trace width will handle a certain amount of current.
What is the Trace current rating





Conductor Spacing per MIL-STD-275
Voltage Between Conductors
Minimum Trace Spacing
DC or AC peak volts
Surface Layers Internal Layers
0 - 100v
0.005" 0.004"
101 - 300v
0.015" 0.008"
301 - 500v
0.030" 0.010"

Chart of PWB External Etched Copper Current Capacity:
current rating based on trace cross section in square mils, temperature rise and current in amperes.
Graphic of Minimum Annular Ring, What is a Minimum Annular Ring.


Military Specifications

RoHS - Restriction of Hazardous Substances [RoHS definition]
MIL-PRF-38535 - Integrated Circuits Manufacturing
MIL-PRF-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-55110 - Printed Wiring Board, Rigid, General Specification for
MIL-C-46058 - Insulating Compound, Electrical (For Coating Printed Circuit Assemblies)
MIL-C-47175 - Compound, Polyurethane, for Conformal Coating of Electronic Circuitry
MIL-C-14550 - Copper Plating, (Electro-Deposited)
MIL-I-46058 - Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
MIL-STD-275 - Printed Wiring for Electronic Equipment
MIL-STD-2118 - Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design Requirements for
MIL-T-10727 - Tin Plating: Electro-Deposited or Hot-Dipped, for Ferrous and Non-ferrous metals





Editor note; the list of mil specs is a handy reference, but those documents may be pulled from circulation at any time.


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Modified 1/9/12
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