Graphics Double Data Rate DIMM [GDDR-DIMM, or GDDR DIMM] is similar to
the JEDEC standard for Double Date Rate SDRAMs. This page covers the GDDR
memory modules, which are only found on high-end Video cards used in desktop PCs. Refer to the general Memory Module page for
a more complete listing of different types of modules, manufactures and
descriptions. GDDR1 uses 2.5 volt signalling, GDDR2 uses 1.8 volt
signalling.
GDDR 3 runs at up to around 1.5 times the speed of GDDR 2 but consumes half the power. DDR3 SDRAM devices offer data transfer rates up to 1600 Mbps. Module densities range from 256MByte up to 8GByte for standard JEDEC modules.
GDDR1 Bandwidth: up to 1.2Gbytes/s with a 300MHz clock, GDDR2 Bandwidth: up to 2.0Gbytes/s with a 500MHz clock, GDDR3 Bandwidth: up to 9.6 Gbytes/s with a 1GHz clock. GDDR4 which is just now starting to show up provides a bandwidth of 18GHz
GDDR1 uses 2.5 volt signalling, GDDR2 uses 1.8 volt signalling, GDDR3 uses 1.5 volt signalling.
GDDR memory modules are found in desk tops, and workstations.
Some companies have discontinued GDDR1 support. Example IC package types:
GDDR1; TSOP-66, GDDR2; JEDEC FBGA-84, GDDR3; JEDEC FBGA-136.
Hynix {256Mb/512Mb GDDR, GDDR3, 512Mb GDDR4 SDRAM ICs}
Qimonda {Graphics RAM; GDDR, GDDR2, GDDR3, GDDR5 ICs}
Rambus {GDDR Controller, GDDR1, GDDR2, GDDR3 Controllers}
Samsung Semiconductor Inc. {GDDR1, GDDR2, GDDR3 ICs and GDDR4 memory}
DIMM Sockets; DIMM/SIMM Socket Manufacturers.
Electronic Engineering Key words: DDR, GDDR DIMM, IC Bus Standard, SSTL, SSTL_2, Integrated Circuit Bus, Chip Bus, Chip-to-Chip Bus, micro-processor [uP] buses, Microcomputer Bus, Microprocessor, Memory Busses, Peripheral chip, Memory, Specification, Spec, Interface, IC, Physical Interface, Description, DIMM, DDR-SDRAM, Pin Outs, Buffer, Advanced Memory Buffer, Manufacturers.
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