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Mezzanine boards are small form factor cards designed to plug onto larger form factor boards. The larger main boards can be designed to support one or more Mezzanine boards. Not all mezzanine formats are supported by the main boards.
In addition to the single wide form shown above, M-Modules can be developed into double, triple and quadruple wide configurations. M-Modules are sized such that 4 cards will fit onto a 6U VME module and 2 onto a 3U VME module. Conveniently, because of the way other backplane standards have evolved, 4 units easily fit the front panel space in VXI and 6U cPCI/PXI while 2 will fit in the font panel space of 3U cPCI/PXI and up to 8 will fit in a 1U LXI rack mount carrier.
The M-Module defines the electrical and Mechanical characteristics of the
bus. M-Modules utilize 2-row [40-pin] connectors, while MA-Modules have
3-row [60-pin] connectors for module to main board communication. The
boards come as single or double width sizes.
The M-Module [Mezzanine-Module] Card size is 52.9mm x 148.3mm, there are
other board sizes
The MA-Module [Mezzanine Addition-Module] Card handles more signals [by adding a third row of connectors]. The
M-Module uses an 8-bit, 16-bit or 32-bit data bus, and an 8-bit or 24-bit
address bus. An asynchronous SYSCLK of 16MHz is required. Power supply
voltages of +5v [1000mA], and +/-12 volts [200mA] are required. Standard
TTL logic levels are used.
ANSI/VITA 12-1996
| Pin # | Row A | Row B |
| 1 | /CS | GND |
| 2 | A01 | +5V |
| 3 | A02 | +12V |
| 4 | A03 | -12V |
| 5 | A04 | GND |
| 6 | A05 | /DREQ |
| 7 | A06 | /DACK |
| 8 | A07 | GND |
| 9 | D08 | D00 |
| 10 | D09 | D01 |
| 11 | D10 | D02 |
| 12 | D11 | D03 |
| 13 | D12 | D04 |
| 14 | D13 | D05 |
| 15 | D14 | D06 |
| 16 | D15 | D07 |
| 17 | /DS1 | /DS0 |
| 18 | /DTACK | /WRITE |
| 19 | /IACK | /IRQ |
| 20 | /RESET | SYSCLK |
Manufacturers of M-Modules
Engineering Key words: Mezzanine Bus, Common Mezzanine Card, CMC Bus, Standard, Interface Standard, Specification, Spec, Electrical Interface, IC, Parallel Bus, Physical Interface, Embedded Parallel Computer Bus, Electronic connector Description, Daughter Card Component Manufacturers, Card Dimensions, Board form factor, PCB width, Mezzanine, IEEE Standards: IEEE 1386 and IEEE 1386.1, I/O schemes, Module, Carrier.
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