There are three fundamental grounding techniques;
1. Floating Ground System: The ground plane is not returned to
earth.
2. Single-Point Grounding System: A single physical point in the
circuitry is designated as a ground reference point.
3. Multipoint Grounding System: The ground plane is taken to
earth, effectively taking each point connected to the ground plane to
earth.
Refer to MIL-HDBK-1857, GROUNDING, BONDING AND SHIELDING DESIGN PRACTICES
-------------------------------------------
ANTENNAS, Frequently Asked Questions
{Virtual Technologies, Ltd. }
"...a power plane at RF will act like a patch antenna, spreading spurious signals all over the PWB."
Radiated Noise from Cables
Murata Manufacturing Co., Ltd
Capacitor Info
{Cap Layout Info-Material-Temperature-Chip Sizes}
-------------------------------------------
Design Rules:
1: Stack power planes next to ground planes so they capacitively
couple. Coupling the power plane to the ground plane reduces the number
of by-pass capacitors required in the circuit.
2: When possible use wide traces for power and ground. Thicker
traces reduce the trace impedance and allow the line to carry higher
current loads.
3: Avoid placing slots in ground planes. Slots in ground planes
force the current to flow around the slot, separating the return current
from it signal trace. Slots may be placed at the edges of the board where
signal trace aren't run.
4:It is highly recommended that high speed signals do not cross reference planes. Whenever a signal has to cross reference plane, it is recommended that a low value bypass capacitor between the planes be used as close as possible for decoupling.
5: Avoid Ground
Loops when possible, and avoid ground loops in low-level,
low-frequency circuits. A ground loop is an unwanted current loop. The
current flowing in the loop generates additional noise and provides no
benefit to the circuits operation.
5: Board Stack-up; Adjacent Power and Ground planes form a capacitor. It is highly recommended to use the power planes as a low value, high speed, bypass capacitor. This can be accomplished by reducing the thickness of the core between adjacent power planes. So when determining the Printed Wiring Board [PWB] stack-up try to place a power plane next to a ground plane to form a 'board-wide' capacitor.
Design Considerations:
Chart of PWB
External Etched Copper Current Capacity: current rating based on
trace cross section in square mils, temperature rise and current in
amperes.
Chart of PWB
Internal Etched Copper Current Capacity: current rating based on
trace cross section in square mils, temperature rise and current in
amperes.
Notes on Chassis
Grounding
Back to the Logic Design Page
| PWB Info | Component Chip Sizes | Capacitor IC By-Pass Design Information | IC Package Type Definitions | PWB Production Vendor Services |
|
|||||||
| Home | |||||||
|
|
|||||||
|
|
|
|
|
|
|
|
| Distributors | Components | Equipment | Software | Standards | Buses | Design | Reference |