Engineering Acronyms
"A", "B", "C", "D", "E", "F", "G", "H", "I", "J", "K", "L", "M",
"N", "O", "P", "Q", "R", "S", "T", "U", "V", "W", "X", "Y", "Z"

'La' to 'Le', 'Lf' to 'Lo', 'Lp' to 'Lz'

L - Inductance [Inductor Manufacturers]
L - Low power [logic series]
LAN - Local Area Network [LAN Definition]
LAP-B - Data Link Layer protocol [CCITT Recommendation X.25]
LAP-D - link access procedure D
laser - Light Amplification by Stimulated Emission of Radiation
LASINT - laser intelligence
LATA - local access and transport area
LBA - Logical Block Address
LBO - Linear Burst Order
LBO - line build-out
LC - limited capability
LCA - Logic Cell Array [Macrocell Diagram]
LCC - Leaded Chip Carrier [IC package]
LCCC - Leaded Ceramic Chip Carrier [IC package]
LCD - liquid crystal display [LCD Display Manufacturers]
LCoS - Liquid Crystal on Silicon
LCX - low voltage CMOS [logic series]
LD - long distance
LDCC - Leaded Chip Carrier [IC package]
LDD - Laser Diode Drivers
LDLVA - Successive Detection Log Video Amplifiers
LDM - LED Dot Matrix Module
LDM - limited distance modem [Modem Manufacturers]
LDO - Low DropOut [regulator] [LDO Regulator Manufacturers]
LE - Logic Element
LEC - local exchange carrier
LED - light-emitting diode [LED Terms], [LED Manufacturers]


PC motherboard

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