IC Package Type Definitions

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BCC: Bump Chip Carrier
BGA: Ball Grid Array; BGA graphic
BQFP: Bumpered Quad Flat Pack
CABGA/SSBGA: Chip Array/Small Scale Ball Grid Array
CBGA: Ceramic Ball Grid Array
CFP: Ceramic Flat Pack
CPGA: Ceramic Pin Grid Array
CQFP: Ceramic Quad Flat Pack
TBD: Ceramic Lead-Less Chip Carrier
DFN: Dual Flat Pack, No Lead
DLCC: Dual Lead-Less Chip Carrier (Ceramic)
ETQFP: Extra Thin Quad Flat Package
FBGA: Fine-pitch Ball Grid Array
fpBGA: Fine Pitch Ball Grid Array
HSBGA: Heat Slug Ball Grid Array
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture
LBGA: Low Profile Ball Grid Array
LCC: Leaded Chip Carrier LCC Graphic
LCC: Leaded Chip Carrier Un-formed LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array [Pins are on the Motherboard, not the socket]
LLCC: Leadless Leaded Chip Carrier LLCC Graphic
LQFP: Low Profile Quad Flat Package
MCMBGA: Multi Chip Module Ball Grid Array
MCMCABGA: Multi Chip Module-Chip Array Ball Grid Array
MLCC: Micro Lead-frame Chip Carrier
PBGA: Plastic Ball Grid Array
PLCC: Plastic Leaded Chip Carrier
PQFD: Plastic Quad Flat Pack
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package PSOP graphic
QFP: Quad Flatpack QFP Graphics
QSOP: Quarter Size Outline Package [Quarter Pitch Small Outline Package]
SBGA: Super BGA - above 500 Pin count
SOIC: Small Outline IC
SOJ: Small-Outline Package [J-Lead]; J-Lead Picture
SOP: Small-Outline Package; SOP IC, Socket
SSOP: Shrink Small-Outline Package
TBGA: Thin Ball Grid Array
TQFP: Thin Quad Flat Pack TQFP Graphic
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVSOP: Thin Very Small-Outline Package
VQFB: Very-thin Quad Flat Pack

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C-DIP: Ceramic Dual In-line Package
CERDIP: Ceramic DIP
CPGA: Ceramic Pin Grid Array
DIP: Dual In-line Package; DIP Socket Styles
TBD: Dual In-line Zig-Zag Package; Zig-Zag Package
HDIP: Hermetic DIP
PDIP: Plastic DIP [P-DIP]
PGA: Pin Grid Array; PGA IC Graphic
PPGA: Plastic Pin Grid Array
Shrink DIP: Shrink Dual In-Line Package
SIP: Single In-line Package; SIP Package Drawing

Pages with Transistor Case Types; Transistor Metal Can Drawings, Diode Packages

Mechanical drawings for some of the devices were removed from the web site because of bandwidth issues.

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Selected Military Specifications:
MIL-STD-1835C - Electronic Component Case Outlines
MIL-HDBL-6100 - List of Case Outlines and Dimensions for Discrete Semiconductor Devices
MIL-M-55565C - Microcircuits, Packaging of
MIL-STD-1285C - Marking of Electrical and Electronic Parts

stinet; DOD site with MIL Specs on the web

{IC Package Type Index}

Semiconductor Integrated Circuit [IC] manufacturers are listed under the Components Icon below.
Engineering Key words for this page: Integrated Circuit, IC, Physical Package, Descriptions, Dimensions, Mechanical Drawings, Surface Mount,
Through Hole, Devices, Package Outlines, Packaging, Leaded, SMT, Device Types, Specification, Standard.

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