IC Package Type Definitions
SOIC


[Surface Mount] [Through Hole]
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Surface Mount Device Package Types

SOIC

The Small Outline Integrated Circuit [SOIC] Plastic Package is shown above. In large graphic SOIC Gull Wing

BGA: Ball Grid Array
BQFP: Bumpered Quad Flat Pack
CBGA: Ceramic Ball Grid Array
CFP: Ceramic Flat Pack
CGA: Column Grid Array
CPGA: Ceramic Pin Grid Array
CQFP: Ceramic Quad Flat Pack
TBD: Ceramic Lead-Less Chip Carrier
DLCC: Dual Lead-Less Chip Carrier (Ceramic)
FBGA: Fine-pitch Ball Grid Array
fpBGA: Fine Pitch Ball Grid Array
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Graphic
LCC: Leaded Chip Carrier [also Leadless] LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array [Pins are located on the Mother board, not the socket]
LQFP: Low-profile Quad Flat pack
MLCC: Micro Leadframe Chip Carrier
MLP: Micro Leadframe Package
MQFP: Metric Quad Flat Pack
PBGA: Plastic Ball Grid Array
PLCC: Plastic Leaded Chip Carrier
PQFD: Plastic Quad Flat Pack
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package
QFP: Quad Flat pack
QSOP: Quarter Size Outline Package
SOJ: Small-Outline Package [J-Lead]
SSOP: Shrink Small-Outline Package
TQFP: Thin Quad Flat Pack
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVSOP: Thin Very Small-Outline Package
VQFB: Very-thin Quad Flat Pack

A general Engineering List of Acronyms

{SOIC Package Types Index}


Selected Military Specifications: [MIL Specs]
MIL-STD-1835C - Electronic Component Case Outlines
MIL-HDBL-6100 - List of Case Outlines and Dimensions for Discrete Semiconductor Devices
MIL-M-55565C - Microcircuits, Packaging of
MIL-STD-1285C - Marking of Electrical and Electronic Parts

{SOIC Package Type Index}

Related pages on this site:
Trace Termination Schemes Ground / Power Plane Component Chip Sizes Capacitor IC By-Pass Info CERDIP Pack Types

Semiconductor Integrated Circuit [IC] manufacturers are listed under the Components Icon below.
Engineering Key words: Integrated Circuit, IC, Physical Package, Descriptions, Dimensions, Mechanical Drawings, Surface Mount, Through Hole, Devices, Package Outlines, Packaging, Leaded, SMT, Device Types, Specification, Standard.


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Last Modified 5/11/08
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