IC Package Type Definitions
CERDIP

[Surface Mount] [Through Hole]
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The Ceramic Dual In-Line Package [DIP] is shown above. In this case a Ceramic glass-sealed package.

Additional Through Hole Package Types
C-DIP: Ceramic Dual In-line Package
CERDIP: Ceramic DIP Ceramic DIP
CPGA: Ceramic Pin Grid Array
DIP: Dual In-line Package DIP Graphic
DI: Dual In-line Dual In-Line Dual Row
TBD: Dual In-line Zig-Zag Package; Zig Zag Graphic
HDIP: Heat-sinked DIP
HDIP: Hermetic DIP
HSIP: Heat-sinked Single In-line Package
HZIP: Heat-sinked ZIP
PDIP: Plastic DIP [P-DIP]
PGA: Pin Grid Array; PGA Graphic
PPGA: Plastic Pin Grid Array
Shrink DIP: Shrink Dual In-Line Package
SIP: Single In-line Package, SIP Package graphic
SSIP: Shrunk-lead Single In-line Package
SZIP: Shrunk-lead ZIP
WDIP: Windowed DIP
ZIP: TBD

Graphic of Through Hole Devices, Transistor Case Types; Transistor Case Drawings

{IC DIP Package Types Index}

Selected Military Specifications [MIL Specs]:
MIL-STD-1835C - Electronic Component Case Outlines
MIL-HDBL-6100 - List of Case Outlines and Dimensions for Discrete Semiconductor Devices
MIL-M-55565C - Microcircuits, Packaging of
MIL-STD-1285C - Marking of Electrical and Electronic Parts

{IC DIP Package Type Index}

Semiconductor Integrated Circuit [IC] manufacturers are listed under the Components Icon below.
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Engineering Key words: Integrated Circuit, IC, Physical Package, Descriptions, Dimensions, Mechanical Drawings, Surface Mount, Through Hole, Devices, Package Outlines, Packaging, Leaded, SMT, Device Types, Specification, Standard.

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