IC Package Type Definitions
CERDIP

[Surface Mount] [Through Hole]
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The Ceramic Dual In-Line Package [DIP] is shown above. In this case a Ceramic glass-sealed package.

Additional Through Hole Package Types
C-DIP: Ceramic Dual In-line Package
CERDIP: Ceramic DIP [refer to graphic above]
CPGA: Ceramic Pin Grid Array
DIP: Dual In-line Package
TBD: Dual In-line Zig-Zag Package; Zig Zag Graphic
HDIP: Hermetic DIP
PDIP: Plastic DIP [P-DIP]
PGA: Pin Grid Array; PGA Graphic
PPGA: Plastic Pin Grid Array
Shrink DIP: Shrink Dual In-Line Package
SIP: Single In-line Package

{IC DIP Package Types Index}

Selected Military Specifications [MIL Specs]:
MIL-STD-1835C - Electronic Component Case Outlines
MIL-HDBL-6100 - List of Case Outlines and Dimensions for Discrete Semiconductor Devices
MIL-M-55565C - Microcircuits, Packaging of
MIL-STD-1285C - Marking of Electrical and Electronic Parts

{IC DIP Package Type Index}

Semiconductor Integrated Circuit [IC] manufacturers are listed under the Components Icon below.

Engineering Key words: Integrated Circuit, IC, Physical Package, Descriptions, Dimensions, Mechanical Drawings, Surface Mount, Through Hole, Devices, Package Outlines, Packaging, Leaded, SMT, Device Types, Specification, Standard.

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