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During the start of a transfer, the Master will set the
Data Transfer Bus [DTB] width using the two Data Strobes [DS0, DS1],
Address bit 01 [A01] and bit 02 [A02], and LWORD.
The condition of
these lines at the start of a data transfer informs the Slave of the
incoming data bus width. VME allowed 32 bit BLock Transfer [BLT].
VME64
added a 64bit Multiplexed BLock Transfer [MBLT] which uses the 32 bit
data bus and the 32 bit address bus to transfer data.
Both tables; Extracted from -- VME Interface Board Design Document
1/03/93, Leroy Davis
The Address bus width used by the Master is determined by the setting
of the Address Modifier [AM] codes. The graph shows a range of codes
used for each address bus width.
The tables does not show the other
uses of the AM codes, which include the type of access privilege. A64
uses the full 32 bit address bus and 32 bit data bus [added by VME64].
A40 uses the full 24 bit address bus on J1 and the full 16 bit data bus
on J1 [added by VME64]. Extracted from -- VME Interface Board Design
Document 1/03/93, Leroy Davis


Terminations are used on all VMEbus signal lines except for the
'Daisy-Chained' lines. The resistor values used are 330 ohms (from signal
line) to +5volts [Pull-up], and 470 ohms (from signal line) to Ground
[Pull-down]. The resistor terminations are used at each end of the
VMEbus. The voltage presented by the termination is 2.94 volts +/- 10%.
The thevenin resistance is equal to 194 ohms (+/-5%). The backplane trace
impedance is defined as 100 ohms; however with a fully loaded backplane
[with cards installed] the bus impedance is assumed to drop down below 50
ohms. The thevenin termination impedance of 194 ohms is a compromise
between allows some reflections and not requiring 50 ohm drivers on the
backplane.
Details on Terminations and Reflections is found
under this link. Pull-Up resistor
calculations are listed on it's own page.
Low voltage terminations for 3.3 volts use 220 ohms (from signal line) to
+3.3volts and 1.8K ohms (from signal line) to Ground.
Active termination cost more, but uses much less power; Also see the page
on Trace Reflections.
Common Resistor Network termination packages will be either A SIP, DIP or BGA package.
Vendors that Manufacturer Resistor Networks. Styles Resistor Networks

VME data bus Transfer timing: The Master places data on
the Data Transfer Bus [DTB]. The Master then waits a minimum of 35nS
before bringing one or both of the Data Strobe(s) [DS] low. The Data
Strobe(s) going low indicate to the Slave that the Master has placed
valid data on the bus. There is no defined time for the Slave to acquire
the data and acknowledge the transfer. How ever once the Slave has
latched the data it will bring DTACK low. The Master will then release
the Data Strobe(s). Once both of the data strobes are taken high the
slave will release DTACK completing the data transfer cycle.
The level of
the data strobes during transfer indicate which bytes are accessed.
Extracted from -- Interface Board VME Design 1/03/93, Leroy Davis

The VMEbus Master takes IACK high and places the address
and AM [0-5] codes on the bus.
Once the lines have been valid for 35nS
the Master takes the Address Strobe [AS] low to indicate a valid address
on the bus.
For Interrupt cycles the IACK lines are driven low. Extracted
from -- Interface Board VME Design 1/03/93, Leroy Davis


A VMEbus BLock Transfer [BLT] consists of a single Address
cycle followed by up to a 256 Byte Data transfer [in ether 8, 16, or 32
bit segments].
VME64 added the Multiplexed BLock Transfer [MBLT]. MBLT
uses all 32 data bits and all 32 address bits to transfer 64 data bits at
once over the bus.

The data charts above relate to rev. 'C' and 'D' of the VME spec [which
was replaced by VME64]. The newer versions of the spec added two new
enhancements, termed 2eVME and 2eSST.
2eVME which means "2 Edges", increased transfer speed by reducing
data transfers from 4 edges to 2. Instead of the source taking DAV low
[data valid], the slave taking DTACK low [data accepted], than the source
bringing DAV high, and waiting for the slave to take DTACK high which
would allow a new cycle to begin. The new process transfers data on each
edge of DAV, effectively doubling the data transfer rate. So DAV going
low would allow one data transfer, waiting for a low on DTACK, than DAV
going high would allow another data transfer.
2eSST which means "2 Edges, Source Synchronous Transfer"; adds to
2eVME, 2eSST does not wait for an acknowledgment (during data phases).
This means that the VME hand-shake does not exist. 2eSST transfers data
at the Masters rate and is not slowed by the slaves ability to accept
data. DS1 is used as the clock when transferring data, and DTACK is used
as the clock when reading data.
IEEE 1101.1 Base Document for Mechanics ~ Defines 3U/6U/9U (high)
x 100/160/220/280/340/400mm (Long) cards
IEEE 1101.10 Mechanics for VME Boards and Subracks
IEEE 1101.11 Mechanics for Rear Transition Modules
Three card heights are allowed with VME; 3U, 6U, or 9U; a single slot
card is 6T wide. Length is either 160mm or 340mm (Norm)
Height is given in 'U' [1U = 43.60mm], Length is given in 'mm', Width is
given in 'T' or HP [1HP = 5.08mm [HP: Horizontal Pitch]; Card sizes
listed below are one slot or 6T wide
A size CCA dimensions = 3U x 160mm. A 3U Printed Wiring Board
[PWB] is 100mm high.
B size CCA dimensions = 6U x 160mm. A 6U Printed Wiring Board
[PWB] is 233mm high.
C size CCA dimensions = 6U x 340mm, ... {H x L x W {@
width=6T}
D size CCA dimensions = 9U x 340mm. A 9U Printed Wiring Board
[PWB] is 360mm high.
A, B, C, and D are VXI terms. VME normally only references 3U or 6U
[dimensions] by a length.
The board thickness for VME cards is 0.063 +/- 0.008 inchs [1.6mm +/-
0.2mm] Thicker or thinner CCAs may not fit in the card guides correctly.
How ever an 0.90 board may work if you mill down the top and bottom
[2.5mm] of the card to 0.63 so it fits in the card guides.
3U, 6U, 9U Card sizes Basic Board Size - 3D
'C' Size 340mm x 233mm {6U} Detailed Mechanical [Dimensions] Form Factor
'D' Size 340mm x 366mm {9U} Detailed Mechanical [Dimensions] Form Factor
VME OEM Card Vendors, products list
VITA {VMEbus International Trade Association}
IEEE {Institute of Electrical and Electronic Engineers, Inc.}
IEEE 1014-1987{VME} The original VME Spec. {3 row P1/P2, 32 bit
Xfers, 64 w/ the address bus MUXed} @ 40MBytes/second [Replaced by
ANSI/VITA 1-1994; VME64]
ANSI/VITA 1-1994 {VME64} added 5 Row P1/P2...many other
features
VITA 1.1-1997 {VME64x; VME64 Extensions} which defined the 'z' and
'd' row of P1, added P0 @ 80MBytes/second
VITA 1.3-1997 Added 9U x 400mm
IEEE 1101.1 Mechanical Specifications
VITA 1.5 SST Source Synchronous Transfer using ETL (ABTE) devices
for the VME64 bus
VITA 4-1997 Added IP Modules
VITA 4.1-1997 Added IP Module mapping to VME64x
ANSI/VITA 5.1-1994{Raceway Interlink} P2
Backplane Interconnect scheme
VITA 6-1994 SCSA
ANSI/VITA 17 -1998{FPDP; Front Panel Data
Port} 32-bit synchronous front panel data bus @ 160MBytes/sec,
differential PECL
ANSI/VITA 10-1995{SKYchannel} P2
used to transfer data @ 320 Mbytes/sec
VITA 12-1996 M-Modules Mezzanine
VITA 18-1997 VME Bus Pin Assignments for Military {MIL-STD-1389}
Format-E Boards and Backplanes
VITA 26-1998 Myrinet-on-VME
VITA 30.2: Separable Power Connectors [pinout for IEC 60603-2 Type
M Connector]
VITA 31 Serial I/O on 2mm
Connectors
VITA 31.1: Gigabit Ethernet [GbE ]on VME64x P0
VITA 32 Processor PMC (PPMC)
VITA 35-2000 PMC Mapping to VME64 P0/P2
VITA 39: PCI-X for PMC and Processor PMC (PMC-X)
VITA 41: VMEbus Switched Serial Standard (VXS)
VITA 42: Express Mezzanine Card (XMC)
VITA 46: VPX
VITA 27 {P2CI} PCI on P2 VME Compatible Interface
[Cancelled]
VME320: 320 Mbytes/sec back-plane. Patented by Arizona Digital,
increased the bus speed to 320 MBps
ISO/IEC 60821 or ISO/IEC 821 [the old number] is the same as IEEE
1014-1987
ISO/IEC 15776 is the same as ANSI/VITA 1 1994
VME320 Info [VME bus operating at 320MBps] Bustronic
The VME bus uses normal TTL devices.
The VME64-ETL specification uses the ABTE (Advanced - BiCMOS - Technology
- Enhanced Transceiver) Logic family.
The VMEbus signal types are listed below:
Open collector signals which require Open Collector drivers and
receivers:
ACFail, BBSY, BERR, DTACK, IACK, SERDAT, SYSFAIL, SYSRESET, [IRQ1 -
IRQ7], and [BR0 - BR3].
Three-State signals which require 3-State drivers and
receivers:
AS, DS0, DS1, DTACK, RETRY, IACK, LWORD, WRITE, [AM0 - AM5], [A01 - A31],
and [D00 - D31].
Totem-Pole signals which require Totem-Pole drivers and
receivers:
BCLR, SYSCLK, SERCLK, IACKIN, IACKOUT, [BG0IN - BG3IN], [BG0OUT -
BG3OUT].
Cypress *These devices are Obsolete
and not recommended for new designs*
{VME Controllers(Master: 32-bit VIC068A / 64-bit VIC64), (Slave: CY7C960
/ CY7C961)}
{VME I/O CY7C964 bus interface - used with either the VIC chips or the
960 series}
Fairchild Semiconductor Corp. {VME320 8-Bit Registered Bus Transceiver ICs}
Inicore Inc. {VMEbus Slave Controller IP Core Vendor}
National Semiconductor Corp {54/74ETL16245, VME 16 bit transceiver Incident Wave Switching IC Manufacturer}
Texas Instruments 'TI' {74VMEH22501, VMEbus 8 bit transceiver/2eSST, also ABTE16245 ICs}
Tundra Semiconductor {VME64 Bus Controller ICs-VME Bridges to PCI/Local Bus, PCI-X to 2eSST VME bridge chip TSI148 "Tempe"}
VITA Product Index {VMEbus International Trade Association}
IC Manufacturers {All other chip types}
VME Slave Interface - Top Level
VME boards are produced with either 96 pin or 160 pin J1/J2 connectors.
Under the latest bus specification (which added the 160 pin connector)
either connector may be used (but I believe both have to be the same
type).
P1 pin out {IEEE 1014-1987}; VMEbus, {96 Pin Connectors Pin-Out: 3 Rows x 32 Pins}
P2 pin out {IEEE 1014-1987}; VMEbus, {96 Pin Connectors Pin-Out: 3 Rows x 32 Pins}
P1 pin out {ANSI/VITA 1-1994}; VME64 bus, {160 Pin Connector Pin-Out: 5 Rows x 32 Pins}
P2 pin out {ANSI/VITA 1-1994}; VME64 bus, {160 Pin Connector Pin-Out: 5 Rows x 32 Pins}
P0 {ANSI/VITA 1-1994}, {95 Pin Connectors: 5 Rows x 19 Pins}
{Pinout is only defined for PMC, Myrinet, ATM I/O and GbE}
SEM E {VITA 18-1997}
VME Bus Pin Assignments for Military {MIL-STD-1389} Format-E Boards and
Backplanes
There are a number of different connector types used with the
VMEbus
P1 and P2 are 96 pin DIN (41612, Type C) 3 rows x 32 pins [Pitch
2.54mm (.100")] @ IEEE 1014-1987; [VME]
P1 and P2 are 160 pin DIN (41612, Type C Expanded) 5 rows x 32
pins [Pitch 2.54mm (.100")] @ ANSI/VITA 1-1994; [VME64]
P1 connectors may also come with an Auto Bus Grant [ABG] option which is
an automatic [mechanical] switching capability built-in to auto jumper
the slot
P2 Split DIN / RF Coax (DIN 41612 Type M) DIN + Coax @ 78 + 2, 60
+ 4, 42 + 6, 24 + 8
P0 95 pin 2mm 5 rows x 19 pins (IEC 1076-4-101), PCI Style @ VITA
1.1-1997
Infiniband [VITA 31 VME64 P0 Backplane Interconnect] 2mm Twin-ax
uses the Gigabit Ethernet HSSDC Connector and Cable (HSSDC - High Speed
Serial Data Connector)
FPDP [ANSI/VITA 17 {FPDP; Front Panel Data Port}] 80 conductor (20
pins x 4 rows), 25mil pitch
The class of connectors determines the number of insertions it's
[Mechanical Endurance] designed to handle per DIN 41612.
Class 1: 500 mating cycles
Class 2: 400 mating cycles
Class 3: 50 mating cycles
VME 3row/5 row DIN Connector Dimensions
2E SysCom Inc. {Type B/C Signal / Type D/F/G/H15/H11/M Power connectors}
3M {3x32 Row DIN 41612-5x19 row 95 pin IESC 1076-4-101 - FPDP Connector}
Advanced-Connectek INC. 'ACON' {VME connector}
AVX Corp. {DIN 41612 Type C/C Expanded 3x32 Row-DIN 41612 Type M -Split DIN/Coax 78 + 2 / 60 + 4 / 42 + 6 / 24 + 8 / 4 + 10}
Comm Con Connectors Inc. {VME Connectors Type C}
Conec {DIN VME 41612/41617 VME connector Manufacturer}
ECS Inc.m{VME DIN 41612 connector Manufacturer}
DINTEK {VME Press Fit connectors}
ept {DIN 41612 VME Connectors/Type B, C, D, E, F, M (Split DIN/Coax) 24 + 8, R}
Erni {3x32 Row-DIN 41612 Type C-Split DIN/Coax Type M 78 + 2 / 60 + 4 / 42 + 6 / 24 + 8-CPCI 2mm type}
Essen Deinki {DIN 41612 Euro/Reverse Euro Connector Manufacturer}
FCI {VME DIN 41612/Split DIN/Coax RF Connectors}
Harting {DIN 41612 - VME 5 and 3 Row Type C connectors}
Hirose Electronic {VME DIN 3/5 Row-DIN 41612/IEC 603-2/DIN 41612M - High-frequency coaxial hybrid connector}
lmi Components {DIN 41612 Type D/E/F VME Connector Manufacturer}
Methode Electronics {VME Connectors}
Molex {VME 3x32 Row-DIN 41612 Type C-Split DIN/Coax Type M78 + 2 / 60 + 4 / 42 + 6 / 24 + 8}
NAIS {VME 3x32 Row-Right Angle/Vertical Male/Female DIN 41612/IEC 603-2 (Supports time difference contact function) Type}
Phoenix {DIN41612 VME connectors, PKZ style connectors}
Tyco Electronics {3x32 Row-DIN 41612 Type C-Split DIN/Coax Type M 78 + 2 / 60 + 4 / 42 + 6 / 24 + 8 - CPCI 2mm type}
Y-connect {VME 3x32 Row-Right Angle/Vertical DIN 41612 Type}
Winchester Electronics {Hybrid VME DIN Multi-purpose Connector (Coax) Manufacturer}
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2mm ['Hard Metric'; IEC 1076-4-101] connector vendor sites are listed on
the cPCI
page
cPCI 2mm connectors mating distances [12.50mm] matches the 96 pin DIN
41612 connectors used with other EuroCard packaging [IEC 273 or IEEE
1101, 1101.10], like VMEbus.
FutureBus connectors, which also use 2mm
style has a mating distance of 10mm, and is not compatible with cPCI
connectors.
A VME Chassis will be between 1 and 21 slots (the maximum).
Care should
be taken producing a 21 slot chassis, with the addition of slide rails
the width may exceed a standard 19" [EIA-310] rack.
So the practical
limit is 20 slots for a chassis mounted in a 19" rack. The term Crate may
also be used to indicate a VME chassis.
The [VMEbus] chassis may except 3U cards, or 3U and 6U cards, and now 9U
cards. The chassis may have a separate card cage to handle the 3U cards.
The chassis only need provide the P1 side of the back plane when only 3U
cards are used. 6U cards require both P1 and P2, and 9U would require the
P1, P2, and P3.
A P0 connector (between P1 and P2) for 6U cards may also
be provided. Regardless of the size of the card the chassis will accept
(3U, 6U, or 9U) all the slots are on .8" centers
VME32 provided a +5volt,and +/-12volt supply; VME64 added a 3.3volt
supply. The 5volt supply should provide only 50mV of ripple.
No currently
produced power supply meets 50mV, I've seen notes on the web indicating
an attempt to update this number.
Companies which produce VME Chassis may be found on the VMEbus Chassis manufacturers page A vendor and VME products listing {This Site}
Companies which produce Racks may be found on the Rack manufacturers page, a vendor and products listing
VME backplanes will always consist of a J1 backplane. Except for the
daisy-chained lines all signals on rows A, B, and C of J1 must be bused.
The J1 connector may be either a 3-row (x32) 96-pin or a 5-row (x32)
160-pin connector.
A VME backplane may also have a J2 backplane (in addition to J1).
The J2
backplane may be a separate PWB located just below the J1 backplane or be
a monolithic backplane containing both J1 and J2.
All signals on row B of
J2 must be bused. The J2 connector may be either a 3-row (x32) 96-pin or
a 5-row (x32) 160-pin connector.
The VMEbus backplane may have between 1 and 21 slots. The length of any
VME backplane is [number of slots] x [20.32mm].
The height of J1 (or
separate J2) backplane is 130mm. A monolithic J1/J2 backplane will be
160mm.
--------------------------------------------
How to spec out an equipment chassis; Chassis Design Considerations.
Companies which produce VME Backplanes may be found on the VMEbus Backplane manufacturers page. A VME vendor and products listing.
Engineering Design Key words: VME Backplane Bus, VMEbus, VME64,
Embedded Computing Architecture, Standard, Interface Standard,
Specification,
IEEE 1014 Spec, Interface, IC, Integrated Circuit,
Physical Interface, Description, VMEbus chassis, Manufacturers, scalable
Parallel bus, Vendors, PWB,
CCA, Circuit Card, Printed Wiring Board, Form
Factor, Dimensions, Mechanical, Mechanics, Height, High, Long, VME {Versa
Module Europa}, Termination,
Pull-up, Pull-down, Terminations,
Reflections, 2eSST.
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