IEEE 1355
Heterogeneous Interconnect (HIC)
Low-cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction
This page describes the basic electrical requirements for IEEE 1355.
However it does not appear that the standard was ever updated after its original 1995 release date.
So caution should be used when designing to IEEE 1355, as it may no longer be supported, or up to date.
The HIC {Heterogeneous InterConnect} bus provides a bidirectional
serial interconnect which builds a scalable parallel system using a
pair(s) of unidirectional lines.
IEEE-1355 defines the physical and Logic
Link layers between Chip-to-Chip, Board-to-Board, or Chassis-to-Chassis
[via cabling].
The Electrical and timing interfaces are defined, as well
as the cabling, connectors and pin-out [for both electrical and fiber
interfaces].
Board traces are defined to be 'Transmission Lines' with an
impedance of either 50 or 100 ohms.
The electrical interface is specified
as standard TTL interfaces [switching level], using either
3.3v or 5 volt supplies. Two links are defined; Data and Strobe.
The
Strobe line changes state only when the data line carries the same level
on the next bit time, so the 'clock' is derived from both the Strobe and
Data lines.
Data is sent as 8 bit long characters [LSB first] preceded by
a Start bit [0], and a parity bit [Odd]. An inversion bit and Stop bit
[0] are sent after the data word.
A number of Control characters are
defined. The HIC bus uses 8B/12B
encoding (each 8 bit byte is translated into a 12 bit character in order
to equalize the numbers of 1's and 0's sent).
Which is 1 Start bit, 1
Parity bit, 8 Data bit, 1 Inversion bit, 1 Stop bit; 12 bits which
represent one 8 bit word.
The FIber-Optic version uses the data encoded
into Symbols
Four types of interconnect media are provided [Connectors per IEC
1076-4-107]:
Copper wire [4] wires [1 Meters cable distance at 38MBps]
Differential [4] twisted pairs [1 to 10 Meters cable distance at
38MBps]
Fiber-optic cable [100 to 3000 Meters cable distance at 169MBps,
distance depends on fiber type]
Single-Ended [Coaxial cable] [8 Meters maximum cable distance at
169MBps]
Runs between 10 Mbps and 200Mbps and 1Gbps at standard TTL transition
levels allowing either 3.3 volt or 5 volt levels.
ANSI/VITA13: VMEbus Pin Assignment for ISO/IEC 14575, IEEE 1355-1995 (H.I.C.)
VITA 13 re-maps IEEE Std 1355 onto the VMEbus, although VITA-13 does not appear to be a valid document standard any longer.
So any VMEbus system using a 3-row P2 connector might be mapping the user defined pins as a HIC interface.
Than again the 160 pin connectors were introduced in 1997, rendering the 96 pin connectors out-dated.
Also the VPX series of VME boards were introduced in 2007, rendering the 160 pin connectors out-dated.
In other words the HIC interface may reside on a legacy VMEbus, but would not be found on a newer system.
IEEE 1355-1995: IEEE Standard for Heterogeneous Interconnect (HIC)
(Low-cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
ISO/IEC 14575 DIS:
IEEE 1355.2: SpaceWire,
SpaceWire Serial Point-to-Point Links ECSS-E-50-12; Draft Issue C
IEEE; Institute of Electrical and Electronic Engineers, Inc. [www.ieee.org]
esa; European Space Agency [www.esa.int]
This table represents the signal assignments for a HIC interface on the VMEbus.
As found on a 3-row 96 pin VME DIN connector, using the user defined pins on rows A and C.
Row B is pre-defined in the VME specification and remains unchanged.
Note that this pre-dates the 5-row connectors that were introduced a few years later.
- | Row A | Row B | Row C |
1 | DATAOUT DS4 | +5V | DATA IN DS3 |
2 | GND DS4 | GND | GND DS3 |
3 | STROBE OUT DS4 | RETRY | STROBE IN DS3 |
4 | STROBE IN DS4 | A24 | STROBE OUT DS3 |
5 | GND DS4 | A25 | GND DS3 |
6 | DATA IN DS4 | A26 | DATA OUT DS3 |
7 | DATA OUT DS5 | A27 | DATA IN DS2 |
8 | GND DS5 | A28 | GND DS2 |
9 | STROBE OUT DS5 | A29 | STROBE IN DS2 |
10 | STROBE IN DS5 | A30 | STROBE OUT DS2 |
11 | GND DS5 | A31 | GND DS2 |
12 | DATA IN DS5 | GND | DATA OUT DS2 |
13 | DATA OUT DS6 | +5V | DATA IN DS1 |
14 | GND DS6 | D16 | GND DS1 |
15 | STROBE OUT DS6 | D17 | STROBE IN DS1 |
16 | STROBE IN DS6 | D18 | STROBE OUT DS1 |
17 | GND DS6 | D19 | GND DS1 |
18 | DATA IN DS6 | D20 | DATA OUT DS1 |
19 | DATA OUT DS7 | D21 | DATA IN DS0 |
20 | GND DS7 | D22 | GND DS0 |
21 | STROBE OUT DS7 | D23 | STROBE IN DS0 |
22 | STROBE IN DS7 | GND | STROBE OUT DS0 |
23 | GND DS7 | D24 | GND DS0 |
24 | DATA IN DS7 | D25 | DATA OUT DS0 |
25 | DATA OUT CONTROLUP | D26 | DATA IN CONTROLDOWN |
26 | STROBE OUT CONTROLUP | D27 | STROBE IN CONTROLDOWN |
27 | GND CONTROLUP | D28 | GND CONTROLDOWN |
28 | STROBE IN CONTROLUP | D29 | STROBE OUT CONTROLDOWN |
29 | DATA IN CONTROLUP | D30 | DATA OUT CONTROLDOWN |
30 | Reserved | D31 | Reserved |
31 | Reserved | GND | Reserved |
32 | Reserved | +5V | Reserved |
The HIC bus uses standard TTL Switching levels [5V] or 3.3V Low Voltage
[LV] TTL, LV Switching levels for the electrical
interface.
The following page lists TTL IC Manufacturers. All other Integrated
Circuit types IC Manufacturers.
Note when used on the VMEbus has VITA-13 these are just signals running on a backplane between cards.
The signals defined in IEEE-1355 are mapped onto the VME connectors, there are no copper or fiber cables.
The standard engineering warning found on a number of these electrical interface pages; don't design in out-dated standards.
Or, don't design to out-dated standards unless the requirements dictate it, as in communication with an out-dated legacy card is required.
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